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Process Capability
Process Capability

P C B   /   F P C   /   H D I

P C B
Item Standard Advanced
Layer count 32L 40L
Board thickness 5.5mm 6.5mm
Aspect ratio 10:1 25:1
Copper thickness 6OZ 12OZ
Maxium PCB size 1L: 500×1200mm 540×1200mm
2L : 533x610mm 610x1067mm
≥4L: 533x610mm 610x1067mm
Min. 4L board thickness 0.38mm 0.35mm
Min. hole & pad size 0.20/0.40mm 0.15/0.35mm
Drilling Acuracy ±0.05mm ±0.038mm
PTH hole size tolerance ±0.05mm ±0.038mm
Min.outer layer  line width/spacing(1/3 OZ base copper+plating) 0.075mm/0.075mm 0.065mm/0.065mm
Min .Inner Layer line width/spacing(H OZ base copper) 0.075mm/0.075mm 0.05mm/0.05mm
Impedance tolerance ±8% ±6%(Differential impedance)
Min. solder mask dam 0.065mm 0.065mm
Contour tolerance ±0.05mm ±0.05mm
Minimum core thickness 0.05mm 0.038mm
Minimum dielectric thickness 0.064mm 0.038mm
Copper feature to edge, v-cut (30°) 0.40 mm 0.36 mm
Copper feature to PCB edge, routed 0.25mm 0.20mm
Surface finish ENIG, OSP,Lead free HASL, Gold plating(hard gold),Immersion Silver, Immersion Tin,Carbon ink
F P C
Item Standard Advanced
Layer count 8L 10L
Maxium PCB size 2000*240mm 2000*240mm
Min. line width/spacing 1/4OZ 0.04mm 0.04mm
1/3OZ 0.05mm 0.05mm
1/2OZ 0.055mm 0.055mm
Min. PTH size 0.15mm 0.1mm
Min. PTH PAD size 0.25mm 0.2mm
Min. blind via diameter 0.10mm 0.075mm
Min. capture pad size 0.25mm 0.175mm
PTH hole size tolerance ±0.05mm ±0.038mm
Impedance tolerance ±8% ±6%(Differential impedance)
Min. solder mask bridge 0.065mm 0.065mm
Coverlay registration tolerance 0.15mm 0.10mm
Min. slot hole width 0.60mm 0.50mm
Contour tolerance ±0.05mm ±0.05mm
Surface finish ENIG, OSP, Gold plating(hard gold)
H D I
Item Standard Advanced
HDI stage 3+N+3 5+N+5
Aspect ratio for blind via 1:1 1:1
Min. 8L board thickness 0.70mm 0.65mm
Min. line width/spacing 0.05/0.05mm 0.05/0.05mm
Key line/tolerance 0.065mm/15% 0.06mm/10%
Min. blind via diameter 0.10mm 0.09mm
Min. capture pad size 0.23mm 0.20mm
Min. PTH diameter 0.20mm 0.175mm
Min. PTH PAD size 0.35mm 0.30mm
Min. CSP/BGA pitch 0.40mm 0.35mm
PTH hole size tolerance ±0.05mm ±0.038mm
Impedance tolerance ±8% ±6%(Differential impedance)
Min. solder mask bridge 0.065mm 0.065mm
Min. clearance(copper to SM opening) 0.038mm 0.025mm
Contour tolerance ±0.05mm ±0.05mm
Surface finish ENIG, OSP,Lead free HASL, Gold plating(hard gold),Immersion Silver, Immersion Tin, Tin plating, Silver plating, Carbon ink
  • wdxpcb

    WDXPCB is a professional PCB manufacturer and exporter located in Shenzhen, China. providing PCB manufacturing services including HDI,FPC,Rigid-Flex PCB,High Multi-layer PCB,and MCPCB

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    Tel: +86-75582944255,82945142
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    Email: market@pcbtrue.com

    Head office:Unit 502, Block B, Jinyuan Business Building, No. 300 Xixiang Avenue, Bao’An District, Shenzhen, China

              

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