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Single / Double-sided PCB Medical PCB by double-sided
Medical PCB by double-sided

Medical PCB by double-sided

Number of layers: 1-2 layers
Board thickness: 0.4-3.2 mm
Vertical and horizontal lines: 10:1
Minimum line width/line spacing: 0.075mm/0.075mm
Surface treatment: Immersion gold, lead-free tin spray, OSP, Immersion tin, Immersion silver
Main applications: automotive, medical, industrial control, communication IoT, photovoltaic, and other basic products.

  • Description

medical double-sided PCB

 

  • Double-Layer/double-sided PCB for medical application:
    Both sides of the board have copper foil conductors, and both the front (Top layer) and the back (Bottom layer) can be connected to each other through vias. Since both sides can be wired, the usable area is double that of a single panel, making it more suitable for products with complex circuits. The front side is designed to hold the parts, while the back side is the soldering surface for the parts' legs.
  • Material
    For simple and low-end electronic products, FR-1 or FR-2 (phenolic paper, commonly known as Bakelite) may be chosen as the material for cost consideration, but most of them still use FR-4, the mainstream substrate material introduced above.

    • (A) PTFE (Teflon substrate)
      High Frequency (HF) PCB, high-frequency electronic equipment is the trend of development today, especially in the wireless network environment. Satellite communication is developing rapidly, and communication products are also developing towards high speed and high frequency. Therefore, the development of new products always requires the use of high-frequency substrates, satellite systems, cell phone receiving base stations, etc. These communication products must use high-frequency PCBs. Generally speaking, high frequency can be defined as a frequency above 1GHz. Currently, PTFE material is widely used in high-frequency PCB manufacturing, also known as Teflon, and its frequency is usually higher than 5GHz. example: ROGERS RO3000 series
    • (B) Alumina (ceramic substrate)
      Unlike traditional FR-4 or aluminum substrates, ceramic substrates have a thermal expansion coefficient close to that of semiconductors and high thermal resistance, making them suitable for products with high heat generation (high brightness LEDs, solar energy). Generally speaking, ceramic substrates have high enough mechanical strength to be used as support components in addition to mounting components; good processability, high dimensional accuracy, and easy multi-layering. Example: ROGERS RO4000 series
    • (C) Aluminum (Aluminum substrate)
      Aluminum laminate is a unique metal-based laminate with good thermal conductivity, electrical insulation, and machinability. It is mostly used in LED and power conversion electronic products. The LED generates high heat when emitting strong light, and aluminum laminate will dissipate the heat directly from the component. Aluminum substrates can extend the life of LED components and provide higher stability. Aluminum substrates can be found in street lights, stop lights and lighting fixtures. It also allows power converters to vary the current and regulate electronic devices. Aluminum substrates are usually made as single-sided but are also available as double-sided. Multi-layer aluminum substrates are more difficult to fabricate.
    • (D) Others
      FR series include FR-3, FR-5, FR-6, etc. CEM series CEM-1 to CEM-5

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    WDXPCB is a professional PCB manufacturer and exporter located in Shenzhen, China. providing PCB manufacturing services including HDI,FPC,Rigid-Flex PCB,High Multi-layer PCB,and MCPCB

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