Type: First-order, second-order, third-order and Anylayer HDI
Minimum 8-layer board thickness: 0.7mm
Minimum line width/line spacing: 0.05mm/0.05mm
Minimum hole diameter: 0.1mm
Surface treatment: sink gold, lead-free tin spray, OSP, sink tin, sink silver
Main applications: communication IoT, automotive, industrial control, POSS machines, drones, and other high-end products
High Density Interconnect (HDI) PCBs represent one of the fastest-growing segments of the PCB market.
Because of its higher circuit density, HDI technology can incorporate thinner lines and spaces, smaller through-holes and capture pads, and higher connection pad densities. High-density PCBs feature blind and buried vias, often containing microvias 0.006 inches in diameter or even smaller. More space can be freed up on your printed circuit boards, making them more efficient and allowing for faster transfers.