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MCPCB Copper substrate
Copper substrate

Copper substrate

Number of layers: 1-2 layers
Plate thickness: 0.8-3.0mm
Copper thickness: 0.5-8 OZ
Surface treatment: sink gold, lead-free tin spray, OSP, sink tin, sink silver
Main application areas: aluminum base is widely used in power supply, automotive lighting, indoor lighting, copper substrate thermal conductivity up to 300W-450W, mainly used in automotive headlights, taillights and some equipment (such as drones)

  • Description

Aluminum backplane PCB designs also offer a high degree of mechanical stability for applications that require a high level of mechanical stability or are subject to significant mechanical stress. More importantly, they are less susceptible to thermal expansion than glass fiber-based structures. If your design does not require a high level of heat transfer, but the board will be subject to a high level of mechanical stress or has very tight dimensional tolerances and will be subject to a lot of heat, it may be warranted to use an aluminum backplane design.

Finally, aluminum is not an available metal backing material. Copper and copper alloys, although less popular due to their higher cost, can also be used as backing materials. Copper and copper alloys offer a higher level of performance than aluminum in terms of heat dissipation. Therefore, if the standard aluminum backing design does not meet the thermal requirements of the design, consider using copper as the next step in solving the problem.

In summary, using an aluminum backing solution can improve the reliability and longevity of a design through temperature control and the resulting low component failure rate. In addition to excellent temperature control characteristics, aluminum designs offer high levels of mechanical stability and low levels of thermal expansion. When standard fiberglass (FR4) backed PCBs cannot meet the thermal and density requirements of your design, aluminum-backed PCBs can provide the answer.


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