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HDI Communication HDI PCB
Communication HDI PCB

Communication HDI PCB

Type: First-order, second-order, third-order and Anylayer HDI
Minimum 8-layer board thickness: 0.7mm
Minimum line width/line spacing: 0.05mm/0.05mm
Minimum hole diameter: 0.1mm
Surface treatment: sink gold, lead-free tin spray, OSP, sink tin, sink silver
Main applications: communication IoT, automotive, industrial control, POSS machines, drones, and other high-end products

  • Description

Generally speaking, HDI boards are built up using the Build-Up method, where the internal layers are first made or pressed together, then the outer layers are laser drilled and filled with electroplated holes, then the outer layers are covered with insulation (prepreg) and copper foil, and then the outer circuitry is repeated, or laser drilling is continued, stacking the layers one at a time.

Since laser drilling is used many times, the key to the quality of HDI boards is the hole shape after laser drilling and whether the holes can be filled evenly after subsequent electroplating.


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